ORIENTER KIT
PROPIERATARY ORIENTING SOLUTION BY ONE SEMICONDUCTOR FOR ENDURA AND CENTURA PLATFORMS
The laser-based wafer orientation system is designed to accurately determine the orientation of semiconductor wafers during manufacturing processes, which is crucial for ensuring precise alignment within process chambers.
Features and Benefits
Components
▪ High accuracy and repeatability
▪ Fast measurement speed
▪ Non-contact and non-destructive measurement method
▪ Suitable for use in clean room and high vacuum environments
▪ Chamber viewport imperfections are compensated for via calibration during installation
▪ Easy to use and integrate into existing manufacturing processes
▪ Customer configurable via touch GUI settings screen
▪ Dust covers to ensure repeatable accurate orientations
▪ Wafer size: 150mm and 200mm in diameter
▪ Supports different substrates: silicon, quartz, glass, sapphire, and silicon carbide
▪ Supports different wafer shapes: SNNF, JMF, and SMF
▪ Plug and play compatible with OEM stepper motor and connectors
▪ Easy troubleshooting and debugging via GUI
High precision lasermicrometer with mounting brackets, dust covers, and cables.
Drop In replacement utilizing previous mounting holes
A microcontroller-based PCB that controls the stepper motor, reads the laser-micrometer, calculates the wafer orientation and position, communicates with the system controller, and provides a graphical user interface via an LCD.
Operating Principals
The wafer is rotated on the pedestal via belt driven stepper motor.
▪ A high precision laser-micrometer is positioned at the edge of the wafer to read the wafer’s edge position at
▪ each step during the rotation. These edge measurements provide a wafer “profile”.
▪ The wafer registrations (notch or flat/flats) are determined by calculating the “extrapolation error” for each step, which is the deviation from the expected value based on the previous two steps of the profile.
▪ The center of the major registration can be marked and poisoned as specified by the system controller.
▪ Once the registration(s) is marked, the remaining profile data is fi`ed to an ideal sine wave.
▪ The sine wave parameters are used to calculate (Delta r), (Delta Theta), and (R Offset), which are then transmitted back to the system controller via a serial connection.
Specifications
▪ Rotation measurement accuracy: ±0.05 degrees
▪ Position measurement accuracy: ±0.02mm
▪ Measurement speed: < 15 seconds per wafer
▪ Laser power: 62uW
▪ Laser wavelength: Multiple wavelengths (visible red)
▪ Operating temperature: 10°C to 32°C
▪ Humidity: < 40% non-condensing
▪ Power supply: 24VDC
▪ Communication interface: RS232
Semiconductor Wafer Manufacturing
Silicon Carbide Products
Applications
MEMES Device Fabrication
Optical Device Manufacturing
Features and Benefits
Wafer Size
Order
Receivables
150 MM.
ONE-OCP-200
200MM.
ONE-OCP-150
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