

Orienter Kit
PROPIERATARY ORIENTING SOLUTION BY ONE SEMICONDUCTOR FOR ENDURA AND CENTURA PLATFORMS
The laser-based wafer orientation system is designed to accurately determine the orientation of semiconductor wafers during manufacturing processes, which is crucial for ensuring precise alignment within process chambers.
Components
▪ High accuracy and repeatability
▪ Fast measurement speed
▪ Non-contact and non-destructive measurement method
▪ Suitable for use in clean room and high vacuum environments
▪ Chamber viewport imperfections are compensated for via calibration during installation
▪ Easy to use and integrate into existing manufacturing processes
▪ Customer configurable via touch GUI settings screen
▪ Dust covers to ensure repeatable accurate orientations
▪ Wafer size: 150mm and 200mm in diameter
▪ Supports different substrates: silicon, quartz, glass, sapphire, and silicon carbide
▪ Supports different wafer shapes: SNNF, JMF, and SMF
▪ Plug and play compatible with OEM stepper motor and connectors
▪ Easy troubleshooting and debugging via GUI
High precision lasermicrometer with mounting brackets, dust covers, and cables.


Drop In replacement utilizing previous mounting holes
A microcontroller-based PCB that controls the stepper motor, reads the laser-micrometer, calculates the wafer orientation and position, communicates with the system controller, and provides a graphical user interface via an LCD.

Operating Principals
The wafer is rotated on the pedestal via belt driven stepper motor.
▪ A high precision laser-micrometer is positioned at the edge of the wafer to read the wafer’s edge position at
▪ each step during the rotation. These edge measurements provide a wafer “profile”.
▪ The wafer registrations (notch or flat/flats) are determined by calculating the “extrapolation error” for each step, which is the deviation from the expected value based on the previous two steps of the profile.
▪ The center of the major registration can be marked and poisoned as specified by the system controller.
▪ Once the registration(s) is marked, the remaining profile data is fi`ed to an ideal sine wave.
▪ The sine wave parameters are used to calculate (Delta r), (Delta Theta), and (R Offset), which are then transmitted back to the system controller via a serial connection.
Specifications
▪ Rotation measurement accuracy: ±0.05 degrees
▪ Position measurement accuracy: ±0.02mm
▪ Measurement speed: < 15 seconds per wafer
▪ Laser power: 62uW
▪ Laser wavelength: Multiple wavelengths (visible red)
▪ Operating temperature: 10°C to 32°C
▪ Humidity: < 40% non-condensing
▪ Power supply: 24VDC
▪ Communication interface: RS232


Applications


Silicon Carbide Products
MEMES Device Fabrication
Optical Device Manufacturing

Features and Benefits
Semiconductor Wafer Manufacturing
150 MM.
200MM.

ONE-OCP-150

Wafer Size
Order
ONE-OCP-200

Receivables
Fast Delivery
Easy Refund
24/7 Support